
ATEC 2024
ATEC – Asia Technology Entrepreneurship Conference
The Asia Technology Entrepreneurship Conference (ATEC) is the largest university alumni club-led technology conference and startup competition in Asia. Founded by the Hong Kong and South China university and business school alumni clubs of Harvard, Columbia, MIT and Stanford, ATEC’s events are designed to foster active engagement of our alumni with the broader startup ecosystem in Asia, as either founders, mentors or investors.
ATEC believes that technology and entrepreneurship are key pillars in creating long-term value, with these principles being deeply rooted in the reputations of the universities represented by our founding alumni clubs. ATEC’s goal is to spur innovation across Asia by delivering events that highlight the most creative minds and promising startups, including those affiliated with our alumni club organizers, that are successfully executing on their regional and global ambitions.
ATEC is a non-profit organization and all net proceeds from the event go towards the annual prize money for the Startup Competition.
TEC would nominate high-quality startups through a rigorous selection process to arrive at a shortlist of startups that representative. Please contact Tim Cheung at 3910 2726 or tim.cheung@hku.hk for more details.
- ACCESS: To broad Startup Ecosystem & powerful Alumni Club Networks
- CONNECT: With top alumni club affiliated VCs in Hong Kong/Asia and identify potential mentors
- VISIBILITY: Increase recognition among industry peers as well as customers & partners
- AMPLIFY: Your reach through our social media channels and our 40K+ alumni reach
- Technology or technology enabled business
- Currently between the Seed and Series B stages of funding
- All industry sectors welcome
- Company must have an Asia element to business but can be based outside of Asia
- School affiliation for alumni club nominees preferred but not required
ATEC 2024 only accepts applications via nomination by approved organisations. If you are interested in representing TEC/iDendron in the ATEC Startup Competition, please submit your application to us by May 18th, 2024 for our consideration.
- The company must include HKU member(s).
- Please submit a 10-slide presentation in PDF format.
- Please submit a 1-slide company/project summary in PDF format.
- Register Here
If you have any inquiries, please contact Tim Cheung at 3910 2726 or tim.cheung@hku.hk.
- ACCESS: To broad Startup Ecosystem & powerful Alumni Club Networks
- CONNECT: With top alumni club affiliated VCs in Hong Kong/Asia and identify potential mentors
- VISIBILITY: Increase recognition among industry peers as well as customers & partners
- AMPLIFY: Your reach through our social media channels and our 40K+ alumni reach
- Technology or technology enabled business
- Currently between the Seed and Series B stages of funding
- All industry sectors welcome
- Company must have an Asia element to business but can be based outside of Asia
- School affiliation for alumni club nominees preferred but not required
ATEC 2024 only accepts applications via nomination by approved organisations. If you are interested in representing TEC/iDendron in the ATEC Startup Competition, please submit your application to us by May 18th, 2024 for our consideration.
- The company must include HKU member(s).
- Please submit a 10-slide presentation in PDF format.
- Please submit a 1-slide company/project summary in PDF format.
- Register Here
If you have any inquiries, please contact Tim Cheung at 3910 2726 or tim.cheung@hku.hk.
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Key Features of PAG
- Applications are invited all year round.
- Applies to patent applications anywhere in the world.
- Maximum funding support: HK$250,000 or 90% of the sum of the total direct costs of patent application
(including the cost for patent search-cum-technical assessment), whichever is the lower. - The grant is non-transferrable and valid for 3 years from the date of approval of the application.
- Applications will be processed through HKPC on a confidential basis.
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Eligibility
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How to apply
Submit your application here: https://bee.hkpc.org/funding-schemes/pag/?tab=application
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PAG X TEC
HKU TEC is collaborating with the program to assist HKU members in benefiting from the scheme. On May 24, 2024, we invited PAG to our campus to conduct a seminar for more information. The topic is “Unlock the Power of Innovation: Maximize Value and Minimize Risk with Patent Protection”. Join us for an exclusive event where we’ll explore the crucial aspects of patent protection to help you unlock innovation and secure your intellectual property rights.
Seminar 1: Unlock the Power of Innovation: Maximize Value and Minimize Risk with Patent Protection
Date: 24 May 2024 (Friday)
Time: 4PM – 5PM
Location: LG1/F – KKLG103, K.K. Leung Building, Main Campus of The University of Hong Kong
Speaker: Miss YIP Wing Lam, Cody (葉頴霖小姐), Associate Principal Consultant (助理首席顧問)Register Now: https://forms.office.com/r/D5LViiiz8y