• Applications are invited all year round.
• Applies to patent applications anywhere in the world.
• Maximum funding support: HK$250,000 or 90% of the sum of the total direct costs of patent application
  (including the cost for patent search-cum-technical assessment), whichever is the lower.
• The grant is non-transferrable and valid for 3 years from the date of approval of the application.
• Applications will be processed through HKPC on a confidential basis.

• Basic Eligibility

  • Locally incorporated companies; or
  • Hong Kong permanent residents; or
  • Hong Kong residents permitted to remain in Hong Kong for not less than 7 years

  AND

  which/who have never owned any patents in any countries or territories nor received funding under the PAG before will be eligible.

  The applicant must be the sole inventor or one of the joint inventors of the invention.

  The inventor(s) of the invention shall be directly-related party/parties to the applicant company, e.g. owner, shareholder, director or staff. The PAG is for first-time patent seekers only, funding support will not be provided if funding has been granted under the PAG to the applicant company’s related company(ies). For example, company(ies) having a major shareholder (viz. those with 50% or more ownership) in common with the applicant company or company(ies) without major shareholder(s) but having shareholders identical to those of the applicant company) before.

  Other Requirements

  All applications for functional patents and inventions with technology elements and susceptible of industrial application are eligible.

  Designs will not be supported.

Submit your application here: https://bee.hkpc.org/funding-schemes/pag/?tab=application

HKU TEC is collaborating with the program to assist HKU members in benefiting from the scheme. On May 24, 2024, we invited PAG to our campus to conduct a seminar for more information. The topic is “Unlock the Power of Innovation: Maximize Value and Minimize Risk with Patent Protection”. Join us for an exclusive event where we’ll explore the crucial aspects of patent protection to help you unlock innovation and secure your intellectual property rights.

Seminar 1: Unlock the Power of Innovation: Maximize Value and Minimize Risk with Patent Protection

Date: 24 May 2024 (Friday)
Time:  4PM – 5PM
Location: LG1/F – KKLG103, K.K. Leung Building, Main Campus of The University of Hong Kong
Speaker: Miss YIP Wing Lam, Cody (葉頴霖小姐), Associate Principal Consultant (助理首席顧問)

Register Now: https://forms.office.com/r/D5LViiiz8y