
We are excited to invite you to an inspiring “Nothing to Lose: An Unicorn Story from a HKU Engineering Alumnus” on January 15th, 2024, featuring Mr. Chau Chiu Wo.
Mr. Chau Chiu Wo founded Opentrons.com in his basement in 2013 and retired from the company in 2021 with a valuation of $1.8B. With two successful exits and one failure in his career, he is a living example of overcoming fear, failure, and uncertainty.
Mr. Chau Chiu Wo grew up in Tai Wo Hau, graduated from HKU with a degree in Mechanical Engineering in ’86, and later earned a degree in Physics from Georgia Tech
In this session, Mr. Chau Chiu Wo will share his experiences and lessons to guide the new generation of HKU students in finding their own paths.
Event Details:
Date: January 15th, 2024 (Monday)
Time: 15:00 – 16:15
Venue: HKU Tam Wing Fan InnoWing II
Don’t miss this unique opportunity to learn from this inspiring story. The Zoom recording of the talk is available below:
https://hku.zoom.us/rec/share/dhV2PMDsgnLL7hYHyhQ30jwzTV9ND6ZotOd9ouvv7Uq2GKmRL3cU_PhBzrrXb-t1.9EczCYwY4vaLzugL
Password: 7Gfa5&N8
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Key Features of PAG
- Applications are invited all year round.
- Applies to patent applications anywhere in the world.
- Maximum funding support: HK$250,000 or 90% of the sum of the total direct costs of patent application
(including the cost for patent search-cum-technical assessment), whichever is the lower. - The grant is non-transferrable and valid for 3 years from the date of approval of the application.
- Applications will be processed through HKPC on a confidential basis.
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Eligibility
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How to apply
Submit your application here: https://bee.hkpc.org/funding-schemes/pag/?tab=application
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PAG X TEC
HKU TEC is collaborating with the program to assist HKU members in benefiting from the scheme. On May 24, 2024, we invited PAG to our campus to conduct a seminar for more information. The topic is “Unlock the Power of Innovation: Maximize Value and Minimize Risk with Patent Protection”. Join us for an exclusive event where we’ll explore the crucial aspects of patent protection to help you unlock innovation and secure your intellectual property rights.
Seminar 1: Unlock the Power of Innovation: Maximize Value and Minimize Risk with Patent Protection
Date: 24 May 2024 (Friday)
Time: 4PM – 5PM
Location: LG1/F – KKLG103, K.K. Leung Building, Main Campus of The University of Hong Kong
Speaker: Miss YIP Wing Lam, Cody (葉頴霖小姐), Associate Principal Consultant (助理首席顧問)Register Now: https://forms.office.com/r/D5LViiiz8y